With over 40 years of manufacturing experience in both high and low volume products, HTI is the clear leader for your precision component manufacturing needs. HTI facilities & processes are equiped to drive leading edge solutions with outstanding quality. All component manufacturing facilities are in tightly controlled contamination environments. Our highly developed manufacturing & quality systems ensure robust quality, fast lead time, and lowest possible cost.

State of the art, rigorously maintained equipment Contamination controlled manufacturing & inspection Progressive stamping dies for piece part or coil processing of various metal alloys from 0.1-1mm thick Stamping finished critical feature tolerances to +/- 0.008mm at min 1.5 Cpk Precision forming & toolmaking capabilities enable us to make precise thin metal forms. Stamping & forming dies are developed and maintained by our world class toolrooms
Photochemical Machining (Etching)
In house Laser Direct Imaging for small orders In house phototool generation for high volume runs Typical material is stainless steel (SST) and copper (Cu) Other materials are possible - contact us for more info Sheet based processing with material thicknesses from 0.015 mm to 4 mm Multiple material laminates can also be processed, including SST/Polyimide/Cu or SST/Polyimide Through feature tolerance +/- 0.01 mm Partial etch thicknesses range from +/- 0.004-0.006 mm High volume Cu circuit layer etching with 1 mil line space (12 um Cu)
Polymer Patterning
High volume plasma etching capability Wet chemistry etching for specific applications Polyimide, glass, & most polymeric organic materials In house phototool generation, exposing areas up to 508 mm x 762 mm Registration to optical targets within +/- 0.002 mm 0.1 mm min feature size, 0.12 mm min space Total etch variation +/- 0.05 mm
Plating
Electroplating: Cu, Ni, Au Electroless: Ni Pattern plating with photoresist Vacuum deposited seed layers for plating on non-conductive substrates Typical thickenss: 0.1um to 20 um Variation control: +/- 10-50% of target thickenss Product size: 1 mm - 600 mm Solder & gold bondability quality controls
Product Finishing
Stamping Electrochemical metal finishing Chemical metal finishing produces burr free stampings without affecting flatness specs Laser polishing of small surfaces fills voids and reduces surface roughness of coined surfaces ( picture right) Photoimageable polyimide covercoat application Solder screen printing Plasma cleaning Optimized ultrasonic aquaeous cleaning for maximum cleanliness without damaging components